This section introduces features and applications of PIAD®, a low-dielectric adhesive binder resin for 5G/sub6 and millimeter-wave applications,are introduced.
Sustainable Material Exhibition Exhibited Materials
This is a page for the collection of exhibiting materials for the Sustainable Materials Exhibition to be held October 4-6, 2023. You can see the exhibiting materials and detailed documents.
This is the page for exhibiting materials for BioJapan 2023, which will be held on October 11-13, 2023. You can see the exhibiting materials and detailed documents.
This is the page for exhibiting materials for Internepcon Japan2024, which will be held on January 24-26, 2024. You can see the exhibiting materials and detailed documents.