You can download Industry information and new technical information of Arakawa Chemical Industry free of charge.
Internepcon Japan2024 Exhibited Materials
This is the page for exhibiting materials for Internepcon Japan2024, which will be held on January 24-26, 2024. You can see the exhibiting materials and detailed documents.
This section introduces features and applications of PIAD®, a low-dielectric adhesive binder resin for 5G/sub6 and millimeter-wave applications,are introduced.
Sustainable Material Exhibition Exhibited Materials
This is a page for the collection of exhibiting materials for the Sustainable Materials Exhibition to be held October 4-6, 2023. You can see the exhibiting materials and detailed documents.
This is the page for exhibiting materials for BioJapan 2023, which will be held on October 11-13, 2023. You can see the exhibiting materials and detailed documents.